Atlas pixel opto-board production and analysis and optolink simulation studies / von Simon Kirichu Nderitu. 2007
Inhalt
- Abstract
- Contents
- Introduction
- 1 Physics Goals at LHC and ATLAS
- 1.1 The Standard Model
- 1.2 The Range of the Fundamental Forces
- 1.3 The top and the Higgs at LHC
- 1.4 The higgs at LHC
- 2 The LHC and the ATLAS Detector
- 3 The ATLAS Pixel Detector
- 3.1 Electronics of the Pixel Detector: The Module
- 3.1.1 The Sensors
- 3.1.2 Radiation Hardness Property by Type Inversion
- 3.1.3 Radiation Hardness Property by Oxygenating Silicon
- 3.1.4 The Sensor Design Features
- 3.1.5 The Deposition of Charge and Signal Generation
- 3.1.6 The Pixel Cell: Design and Operational Features
- 3.1.7 The Module Controller Chip: Design and Operational Features
- 4 The ATLAS Pixel Optolink and the Opto-Board
- 4.1 Introduction
- 4.2 Overview of the Off-detector Electronics
- 4.3 Overview of the On-Detector Eletronics
- 4.4 The Link Between the Off-Detector and the On-Detector
- 4.4.1 The Off-Detector TTC Transmission Part (BOC TX)
- 4.4.2 The Off-Detector Data Receiving Part (BOC RX)
- 4.5 The Opto-Board
- 4.6 The Optical Fibres
- 5 The Opto-Board Production and Results
- 5.1 Fabrication of the Single Components
- 5.2 The Qualification Specifications
- 5.3 Thermal Characterization Requirements
- 5.4 The Test Set Up
- 5.5 Standardizing the setups
- 5.6 The General Production Measurements Steps
- 5.7 Measurements before Assembly
- 5.8 Measurements After Assembly
- 5.9 After Assembly Functionality Measurements
- 5.10 Quality Assurance Measurements
- 5.10.1 Burn-in Testing
- 5.10.2 Thermal Cycling
- 5.10.3 Full Characterization
- 5.10.4 The Optical Characterization at 10°C
- 5.10.5 The Optical Characterization at optoboard -10 °C
- 5.10.6 The Optical Power Measurement at Saturation
- 5.11 Conclusion
- 6 The Optical Power Calculation
- 6.1 The Components in Consideration
- 6.2 Calculation Strategy
- 6.3 Attenuation and Irradiation Effects
- 6.4 Power Loss Due to Irradiation
- 6.5 The Data Link Optical Power Calculation
- 6.5.1 The RX-plugin Working Range
- 6.5.2 The Optical Power
- 6.5.3 The Minimum Optoboard Power Required
- 6.5.4 Opto-boards with an Optical Power Dispersion
- 6.6 The TTC Link Optical Power Calculation
- 6.7 The TTC Limits
- 6.8 Conclusion
- 7 Timing Characteristics and Bit Error Rate
- 7.1 The System Test at Wuppertal
- 7.2 The Parameters Concerned
- 7.3 The General Procedure of the Study
- 7.4 The Tuning Process
- 7.5 Expected Effect
- 7.6 The Mark-Space Ratio
- 7.7 The Fine Delay
- 7.8 The Inter-relation between MSR and the Fine Delay
- 7.9 The Optimum MSR Settings when No Fine Delay is Applied
- 7.10 The Opto-board PiN Current in relation to MSR and the Fine Delay settings
- 7.11 The Interplay of Parameters and Tuning
- 7.12 Bit Error Counting in the System Test
- 7.13 Conclusion
- Conclusion
- List of Figures
- List of Tables
- Bibliography