Development of the MCM-D technique for pixel detector modules / Christian Grah. Wuppertal : Fachbereich Physik, Berg. Univ., 2005
Content
Contents
Übersicht
Abstract
1 Introduction
2 The Atlas Experiment at the Lhc
2.1 The Standard Model of High Energy Physics
2.2 Lhc -- Physics at the TeV Scale
2.3 The Atlas Detector
3 Pixel Detectors for High Energy Physics Applications
4 MCM--D Technique
4.1 Standard Solution: Flex--Hybrid Approach
4.2 The Multi Chip Module--Deposited Technique
4.3 Comparison of the Solutions
4.4 Interconnection Technologies
5 Experience with the MCM--D Technique
5.1 Achievements in Developing MCM--D Modules for hep Applications
5.2 First Prototypes using MCM--D Technique
5.3 Integrated Resistors in Thin Film Layers
5.4 Estimation of Yield Expectation
5.5 High Voltage Isolation Test
6 The MCM--D Design for Atlas
6.1 Elements of the Prototype 2.0 Sensor Wafers
6.2 Design Layer Description
6.3 Design Rules
6.4 MCM--D Single Chips
6.5 MCM--D Module
6.6 Process Monitoring
7 The MCM--D Process
7.1 Process Flow
7.2 BCB Processing
7.2.1 Basic Properties of BCB
7.2.2 BCB Deposition and Structuring
7.2.3 Repair Options during BCB Processing
7.2.4 Comment on BCB Processing
7.3 Cu Electroplating
7.4 Test Measurements on Wafer Level
7.5 Assembly Steps
7.6 Attachment of a Flexible Printed Circuit to MCM--D Modules
8 Production and Optimization of MCM--D Prototypes
9 Performance of Pixel Detector Prototypes in MCM--D Technique
9.1 Overview of MCM--D Prototype Production
9.2 Single Chip Hybrids
9.3 Irradiation of a MCM--D Single Chip
9.4 MCM--D Module
10 Test Beam Measurements
11 Aspect of MCM--D Processing
11.1 Yield Aspects of the MCM--D Production
11.2 Areas of Possible Optimizations
11.3 Further Upgrading of MCM--D
Summary
A Overview of processed MCMD3 Runs at Izm
B Schematic View of Atlas Pixel Test Setup
List of Figures
List of Tables
Bibliography
Glossary
Description of Acronyms
Acknowledgements